PHOENIX, Arizona -- The SiRFstarII Global Positioning System (GPS) from SiRF Technology Inc. is to be integrated with wireless baseband and applications processors to location-enable a line of mobile device chip sets from Motorola's Semiconductor Products Sector (SPS) the group said today (December 2, 2002).
Motorola intends to implement an enhanced version of the radio frequency IC technology from SiRF using the silicon germanium:carbon process technology option available with Motorola SPS' RF BiCMOS wafer process.
SiRF and Motorola said they plan to develop and jointly market a series of wireless/GPS chipsets for use in the GSM, GPRS and 3G cellular markets, as well as for PDAs, and they are developing joint reference designs for next-generation handsets using existing SiRF GPS and Motorola wireless chipsets.
The first anticipated chip from this agreement is expected to be a GPS RF receiver IC expected to be available from SPS beginning in the second quarter of 2003.
"We believe that the products that result from this agreement will bring the level of integration, cost and performance needed to accelerate the mainstream market acceptance of location technology in markets like wireless handsets and PDAs," said Kanwar Chadha, vice-president of business development and founder of SiRF Technology, in a statement.
