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06 July 2009
Latest Headline
Intel reportedly signs wireless IC supply deal with Nokia
News reports indicate Intel Corp. has reached an agreement to supply chips to Nokia Corp. for its mobile handset products, giving the world's biggest semiconductor company the breakthrough it has been seeking in the communications market.


Comms Tech Front
  • Swedish groups tout first 'commercial' LTE site(05/26/09, 07:17 AM EST)
  • Another patent pool effort emerges for LTE(05/08/09, 07:42 AM EST)
  • Tokyo meeting energizes low power Bluetooth(04/21/09, 11:03 AM EST)
  • Researchers transform optical fiber into solar cell(04/06/09, 09:24 AM EST)
  • Quantum network storage problem overcome(12/08/08, 09:56 AM EST)
     More»

    Comms Market Update

  • Intel reportedly signs wireless IC supply deal with Nokia(06/23/09, 07:58 AM EST)
  • WiMax group calls for patent pool(06/22/09, 08:00 AM EST)
  • Samsung, Toshiba renew NAND patent pact(06/22/09, 06:05 AM EST)
  • Nokia Siemens agree to pay $650M for Nortel assets(06/20/09, 07:36 AM EST)
  • India sets 3G base fee at $835 million(06/19/09, 11:51 AM EST)
     More»

    Comms Product News

  • Video: B'com, Toshiba win sockets in iPhone 3GS(06/19/09, 06:54 PM EST)
  • Under the Hood: Android dreams, GooglePhone delivers(04/06/09, 11:06 AM EST)
  • SDR software mounts TI's LTE-ready chip(02/10/09, 12:09 PM EST)
  • Software-defined test platform targets LTE(02/09/09, 01:50 PM EST)
  • Test emulators address LTE technologies(02/02/09, 04:52 PM EST)
     More»

    Insights

  • As the world turns: recession and engineering(05/31/09, 12:00 AM EST)
  • Letters: Vets, ham operators recall the URC-4 radio(12/16/08, 11:08 AM EST)
  • Opinion: What will next generation embedded design look like?(10/21/08, 01:25 AM EST)
  • Comment: Wireless home network? Any takers?(10/20/08, 12:01 AM EST)
  • Antennas give me a headache(08/09/08, 12:00 PM EST)
     More»

    Press Releases

  • Chelsio Communications Closes Numerous Tier-One OEM Deals for its 10Gb Ethernet NICs ( 06/25/07 05:00 AM EST )
  • StreamAudio Announces Radio Streaming Agreement with Emmis Communications ( 06/25/07 05:00 AM EST )
  • LodgeNet Featuring Turn-Key High Definition TV Solution With EasyHD Service at HITEC 2007 ( 06/25/07 04:30 AM EST )
  • Backspace Unveils IPTV Walled Garden ( 06/25/07 15:35 PM EST )
  • Altera Ships Highest-Density Member of the Cyclone III Family ( 06/25/07 15:00 PM EST )
      More»




  • By Jack Ganssle
    As the world turns: recession and engineering
    There will always be artists, and there will always be engineers. In troubling times, passion counts more than ever.
    More 
    Prototype fuel cell for handsets eyes fivefold run-time boost
    As part of a research collaboration on miniaturized energy sources, the French Atomic Energy Agency (CEA) and STMicroelectronics NV (Geneva) have prototyped a hydrogen fuel cell for mobile phones that aims to reduce dependency on the use of electrical power supplies to recharge batteries. EE Times' Anne-Francoise Pele Takes a closer look.Click here to learn more.

    Tech Article Library
    Check out CommsDesign's Design corner to find a detail technical articles on a host of communication design issues. To access the design corner, click here.

    Phyworks demos 10G copper interconnects
    Communications chip specialist Phyworks (Bristol, England) has demonstrated 10Gbits/s rack-to-rack copper interconnects of up to 30 metres using technology it originally developed for the optical module market. EE Times Europe's John Walko gets the story. Click here for details.



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