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17 March 2010


spetember 1999 cover

Communications Systems Design
September Table of Contents

Volume 5, Number 9

Features

Designing a Hot-Swap Software Architecture
By Robert Largren
Live insertion and the swapping out of boards is rapidly becoming a checklist requirement, particularly in the telecom arena. The CompactPCI Hot-Swap Specification provides the hardware component of the hot-swap puzzle, but it’s hot-swap aware software that completes the picture.

Integrating Fiber and Copper Gigabit Ethernet
By Bill Zabor
Because both copper and fiber transceivers are based on the same set of standards, building a Gigabit fiber-to-copper converter is fairly straightforward. Potential applications for such media converters range from salable products to simple in-house test fixtures that allow copper transceivers to be wrung out using test equipment intended for fiber.

The ARC Core
By Henry Davis
This article provides an architectural overview of a new, configurable DSP core that is available as a fully synthesizable VHDL model (soft core). The ARC core is a customizable microprocessor architecture that has a variety of advantages over conventional approaches.

Communication Processors: A Buyer’s Guide
By Patrick Walsh
Although general-purpose microprocessors are used in many communication equipment designs, they aren’t the only way to go. An entire industry has grown up dedicated to developing and offering specialized communication-oriented processors. This buyer’s guide takes a look at this rapidly proliferating product category.

Columns

Building Blocks
Highway Construction.

Standards & Protocols
CORBA IDL: Application to ORB Services.

Programming & Design
High Tech in Hindsight.

Departments

Uplink
The Voice of Reason.

Technical News
Alliances, agreements, and technology announcements.

Top Ten
Bridging the Gap with MGCP.

New Products
The latest in ICs, components, subsystems, test and measurement, design tools, and software and intellectual property.

CSD 2019
Mini PCI: A New Alternative.





Virtualab

  • Analysts: Five observations on mobile from MWC
  • M'soft says no comment on Project Pink phone
  • What made you become an EE? Join the Conversation
  • Nvidia blames sales shortfall on TSMC
  • MORE
    Prototype fuel cell for handsets eyes fivefold run-time boost
    As part of a research collaboration on miniaturized energy sources, the French Atomic Energy Agency (CEA) and STMicroelectronics NV (Geneva) have prototyped a hydrogen fuel cell for mobile phones that aims to reduce dependency on the use of electrical power supplies to recharge batteries. EE Times' Anne-Francoise Pele Takes a closer look.Click here to learn more.

    Tech Article Library
    Check out CommsDesign's Design corner to find a detail technical articles on a host of communication design issues. To access the design corner, click here.

    Phyworks demos 10G copper interconnects
    Communications chip specialist Phyworks (Bristol, England) has demonstrated 10Gbits/s rack-to-rack copper interconnects of up to 30 metres using technology it originally developed for the optical module market. EE Times Europe's John Walko gets the story. Click here for details.

    Puzzled by a network processing design issue?

    Join former NPF CEO Colin Mick in discussing net processing design issues by clicking here!


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