TOKYO -- Kyocera Corp. today announced development of a low-resistance alumina-based technology from multi-layer chip packages that combines the advantages of low-temperature co-fired ceramics (LTCC) and alumina ceramics for next-generation mobile systems applications.
Kyocera said its new package has the advantage of a copper-type conductor, which provides low resistance and supports high-frequency ICs. The new chip package also provides the traditional advantages of alumina ceramic package, including a high level of mechanical strength and heat dissipation, according to the company.
The product is the first low-resistance alumina ceramic multi-layer package to provide higher levels of support for multi-function, high-frequency chips in communications systems, according to Kyocera.
Currently, most mobile phone systems use low-temperature co-fired ceramics packages, which offer high-frequency properties and low resistance, said the company. The manufacturing process for LTCC requires materials with a low melting point--such as copper conductors and glass--but this package type is inferior to alumina multi-layer packages in terms of mechanical strength and heat dissipation, according to Kyocera.
However, the problem with alumina multi-layer packages has been incorporating copper as a low-resistance conductor. The alumina ceramic packages have used a tungsten-type of material with a high melting point for the conductor, which reduces its ability to handle high frequencies, Kyocera said.
As demand for smaller and thinner mobile communications systems has increased, the need for stronger smaller multi-layer chip packages in also growing, Kyocera noted. This new "low-resistance routing patternalumina multi-layer package" has been developed to incorporate the advantages of both LTCC and alumina ceramics, said the Japanese chip packaging company.
"Going forward, particularly for the modules of mobile phones, we will be able to develop applications for next-generation telecommunications devices with high power and a large electric current, such as a package for high-frequency modules and a package for microwave," said the company is a statement issued today. Kyocera said it has begun accepting orders for the new package.
The resistance of the new alumina package is equal to LTCC packages at 3m ohm/sq compared to 10m ohm/sq for conventional alumina multi-layer packages.
